Bonding 2025

Date: 06.-08. May 2025

Venue: On the campus of TU Dresden

Once again this year, we –Auf dem Campus der TU Dresden Detecon International at the Dresden location – will present our key topic Tool-based Network Planning and Optimization at the largest student career fair, Bonding. We will showcase the innovative planning tool NetWorks and are looking for motivated students to take on exciting challenges as employees, master's thesis candidates, and interns.

We look forward to welcoming you at our booth! (Booth number to follow)